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X.J. Xin     (Schedule)

Associate Professor

Degrees:        

Ph.D.    1992, Mechanical Engineering, University of Sheffield, UK

B.S.      1985, Engineering Mechanics, University of Science and Technology of China

Years of Service: 

7 years of service at KSU

Associate Professor, Dept. of Mechanical and Nuclear Engineering, KSU (2003-present)

Assistant Professor, Dept. of Mechanical and Nuclear Engineering, KSU (1998-2003)

Related Experience:

Courses Taught: 

Taught 9 different courses since 1998.  Recent courses include:

ME 400 Computer Applications in ME                   ME 651 Introduction to Composites

ME 512 Dynamics                                             ME 736 Applied Elasticity

ME 533 Machine Design I                                   ME 836 Intro. to Fracture Mechanics

ME 610 Finite Element Applications in ME       ME 862 Finite Elements

            Industrial Experience:  none

Consulting and Patents:  none

States in Which Registered:  none

Principal Publications in Last Five Years:

  • Xin, X.J., Z.J. Pei, and W.J. Liu. “Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers.” Journal of Electronic Packaging, 126, 177-185, 2004.
  • Sun, Xuekun, Mandy Fouts, Z.J. Pei, and X.J. Xin. "Waviness Removal in Grinding of Wire-Sawn Silicon Wafers: 3D Finite Element Analysis with Designed Experiments." International Journal of Machine Tools and Manufacture, 44, 11-19, 2004.
  • Xin, X.J., Xuekun Sun and Z.J., Pei. “Grinding of 300 Mm Silicon Wafers: Finite Element Analysis of Waviness Removal.” Proceedings of the International Conference on Leading Edge Manufacturing in 21th Century (LEM21), Niigata, Japan, November 3-6, 2003.
  • Xin, X.J., P. Jayaraman, G.S. Daehn and R.H. Wagoner. "Investigation of Yield Surface of Monolithic and Composite Powders by Explicit Finite Element Simulation." International Journal of Mechanical Sciences, 45, 707-723, 2003.
  • Pei, Z.J., Wenjie Liu and X.J. Xin. "Finite Element Analysis for Grinding of Wire-sawn Silicon Wafers: A Designed Experiment." International Journal of Machine Tools and Manufacture, 43, 7-16, 2003.
  • Liu, Wenjie, X.J. Xin and Z.J. Pei. "Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers." American Society of Mechanical Engineers EEP, 2, 89-98, 2002.
  • Liu, Wenjie, Z.J. Pei and X.J. Xin. "Finite Element Analysis for Grinding and Lapping of Wire-sawn Silicon Wafers." Journal of Materials Processing Technology, 129, 2-9, 2002.
  • Xin, X.J., P. Jayaraman, G. Jiang, R.H. Wagoner, and G.S. Daehn, "Explicit FEM Simulation of Consolidation of Monolithic and Composite Powders." Metallurgical and Materials Transactions A, 33A, 2649-2658, 2002.
  • Xin, X.J., W.J. Liu, and Z.J. Pei. “Modeling Of Waviness Reduction in Silicon Wafer Grinding by Finite Element Method.” Proceedings of the International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2002), 24-29, 2002.
  • Anderson, P.M., and X.J. Xin. "The Critical Shear Stress to Transmit a Peierls Screw Dislocation Across a Non-slipping Interface." Multiscale Deformation and Fracture in Materials and Structures - The James R. Rice 60th Anniversary Volume, editors: T. J. Chuang and J. W. Rudnicki, Dordrecht/Boston/London: Kluwer Academic Publishers, 87-105, 2001.
  • Xin, X.J., K. Kollu, and R.H. Wagoner. "Boundary Element Method with Internal Stresses for the Investigation of Dislocation-Boundary Interaction." Materials Science and Engineering A, 309-310, 520-523, 2001.
  • Xin, X.J., R. H. Wagoner, and G. S. Daehn. "A General Numerical Method to Solve for Dislocation Configurations." Metallurgical and Materials Transactions A, 30A, 2073-2087, 1999.

Memberships: 

American Society of Mechanical Engineers

American Society for Testing & Materials

ASM International

Honors and Awards: 

NSF EPSCoR First Award, 1999

Institutional and Professional Service in Last Five Years:

University:  (1) Big 12 Faculty Fellowship Committee

College:  Program Assessment Task Force Committee

Department: (1) Undergraduate Committee; (2) Assessment Committee; (3) Promotion and Tenure Committee; (4) Graduate Committee; (5) Faculty Search Committee; (6) Department Head Search Committee; (7) Faculty Advisor for Open House, 2003 and 2004

Professional:  (1) Reviewer of proposals for AFOSR, Kansas NSF EPSCoR, U.S. Civilian Research and Development Foundation (CRDF), and Ohio Supercomputer Center; (2) Reviewer of papers for the following journals: Composites Science and Technology, Fatigue and Fracture of Engineering Materials and Structures, International Journal of Damage Mechanics, and Composites; (3) Reviewer of textbooks for publishers Prentice Hall and McGraw-Hill; (4) Session chair for the Tenth International Manufacturing Conference in China, 2002.

Professional Development in Last Five Years: 

Project LEA/RN basic level (1999)

Project LEA/RN advanced level (2000)

Other Notable Achievements in Last Five Years:

            Major professor for 2 Ph.D. and 6 M.S. students

Currently, PI or Co-PI of 2 research grants totaling $410,000