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Plasma Lab ICP-RIE Return to Equipment Listing |
The Oxford Plasma Lab inductively-coupled plasma (ICP) reactive ion etching (RIE) system is used to etch detailed cavities into semiconductor substrates. The system can etch holes into GaAs and Si from a few microns up to hundreds of microns deep.
Oxford Plasma Lab 100 ICP Reactive Ion Etch System
Argon plasma glow from the Oxford ICP-RIE.
The higher density of the inductively coupled plasma in the Oxford RIE allows for higher etch rates.
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